GL 535/N

Product features

Semiconductor casing: TO-218 ; TOP-3
Semiconductor mounted by: Screw
Material MICA
Thickness [mm]: 0.05
Insulation capacity: 2.0

Mica wafers in combination with insulating bushes facilitate the isolated mounting of semiconductors to heatsinks and other components. To avoid pockets of air bubbles, the use of thermal compound is recommended. Colour: clear Thickness: 0,05 mm Tolerance: +0,01 / -0,02 mm Heat resistance: +550 °C Dielectric strength: app. 2.5 KV Thermal resistance Rth (K/W) with thermal compound.

Product pictures

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