Screwable High strength
Solderable Simple, durable
Pluggable Quickly
bondable Durable, good heat transfer
Clampable (clip) Simple, durable
3049_1_Titel
Semiconductor casing: TO-220
Semiconductor mounted by: Screw
Heat sink mounted by: Srew-On
Finish Black Anodised
Material AlMgSi0,5
Width [mm]: 18.0
Height [mm]: 20.0
Length [mm]: 25.0
Min. thermal resistance [K/W]: 17.0
Questions on the product
PR 18/25/SE
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3037_1_Titel
Semiconductor casing: DIL
Semiconductor mounted by: Bonding
Heat sink mounted by: Adhesive Bounding
Finish Black Anodised
Material AlMgSi0,5
Width [mm]: 18.9
Height [mm]: 4.8
Length [mm]: 6.3
Standardlänge [mm]: 6.3
Min. thermal resistance [K/W]: 50.0
Questions on the product
PR 8/6,3/SE
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3041_1_Titel
Semiconductor casing: DIL
Semiconductor mounted by: Bonding
Heat sink mounted by: Adhesive Bounding
Finish Black Anodised
Material AlMgSi0,5
Width [mm]: 18.9
Height [mm]: 4.8
Length [mm]: 51.0
Standardlänge [mm]: 51.0
Min. thermal resistance [K/W]: 8.0
Questions on the product
PR 8/51/SE
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3040_1_Titel
Semiconductor casing: DIL
Semiconductor mounted by: Bonding
Heat sink mounted by: Adhesive Bounding
Finish Black Anodised
Material AlMgSi0,5
Width [mm]: 18.9
Height [mm]: 4.8
Length [mm]: 47.0
Standardlänge [mm]: 47.0
Min. thermal resistance [K/W]: 9.0
Questions on the product
PR 8/47/SE
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3039_1_Titel
Semiconductor casing: DIL
Semiconductor mounted by: Bonding
Heat sink mounted by: Adhesive Bounding
Finish Black Anodised
Material AlMgSi0,5
Width [mm]: 18.9
Height [mm]: 4.8
Length [mm]: 37.0
Standardlänge [mm]: 37.0
Min. thermal resistance [K/W]: 11.0
Questions on the product
PR 8/37/SE
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3038_1_Titel
Semiconductor casing: DIL
Semiconductor mounted by: Bonding
Heat sink mounted by: Adhesive Bounding
Finish Black Anodised
Material AlMgSi0,5
Width [mm]: 18.9
Height [mm]: 4.8
Length [mm]: 33.0
Standardlänge [mm]: 33.0
Min. thermal resistance [K/W]: 13.0
Questions on the product
PR 8/33/SE
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23067_1_Titel
Semiconductor casing: TO-220
Semiconductor mounted by: Stick On
Heat sink mounted by: Solder
Finish Black Anodised
Material AlMgSi0,5
Width [mm]: 20.0
Height [mm]: 28.0
Length [mm]: 20.0
Min. thermal resistance [K/W]: 13.0
Questions on the product
CK 960/20/SE
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3053_1_Titel
Semiconductor casing: TO-220
Semiconductor mounted by: Screw
Heat sink mounted by: Srew-On
Finish Black Anodised
Material AlMgSi0,5
Width [mm]: 20.0
Height [mm]: 40.0
Length [mm]: 20.0
Min. thermal resistance [K/W]: 11.0
Questions on the product
PR 13/40/SE
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23332_1_Titel
Semiconductor casing: PGA ; BGA ; IC
Semiconductor mounted by: Bonding
Heat sink mounted by: Adhesive Bounding
Width [mm]: 20.0
Height [mm]: 10.0
Length [mm]: 20.0
Min. thermal resistance [K/W]: 18.0
Questions on the product
PG 2020/10/SE/SF
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23532_1_Titel
Semiconductor casing: TO-218 ; TOP-3
Semiconductor mounted by: Screw
Heat sink mounted by: Srew-On
Finish Black Anodised
Material AlMgSi0,5
Width [mm]: 20.0
Height [mm]: 15.0
Length [mm]: 15.0
Min. thermal resistance [K/W]: 28.0
Questions on the product
AK 352/15/SE
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