PG 3535/10/SE/SF
Product features
Semiconductor casing: | PGA ; BGA ; IC | |
Semiconductor mounted by: | Bonding | |
Heat sink mounted by: | Adhesive Bounding | |
Finish | Black Anodised | |
Material | AlMgSi0,5 | |
Width [mm]: | 35.0 | |
Height [mm]: | 10.0 | |
Length [mm]: | 35.0 | |
Min. thermal resistance [K/W]: | 7.0 |
- Heatsinks for microprocessors (Extrusion Technology) - Direct mounting with self-adhesive foil - Best possible heat radiation from black anodized surface - RthKvalues apply to natural convection (without external ventilation) - Arrangement and number of pins for optimal air flow - Even heat distribution in the base and the pins in the direction of heat flow - Suitable for forced and free convection - Aluminium alloy Al MgSi 0.5 - Thermal conductivity: 180-200 W / mK - Other dimensions and surface finishes by request