PR 8/37/SE
Product features
Semiconductor casing: | DIL | |
Semiconductor mounted by: | Bonding | |
Heat sink mounted by: | Adhesive Bounding | |
Finish | Black Anodised | |
Material | AlMgSi0,5 | |
Width [mm]: | 18.9 | |
Height [mm]: | 4.8 | |
Length [mm]: | 37.0 | |
Standardlänge [mm]: | 37.0 | |
Min. thermal resistance [K/W]: | 11.0 |
- Extruded heatsinks especially for IC’s in DUAL IN LINE case. - Mounting by single component thermal conductive adhesive - Standard length: - 6,3 mm for 14/16 pins - 33 mm for 24 pins - 37 mm for 28 pins - 47 mm for 35 pins - 51 mm for 40 pins - Other lengths and machining on request.