PR 8/51/SE
Product features
| Semiconductor casing: | DIL | |
| Semiconductor mounted by: | Bonding | |
| Heat sink mounted by: | Adhesive Bounding | |
| Finish | Black Anodised | |
| Material | AlMgSi0,5 | |
| Width [mm]: | 18.9 | |
| Height [mm]: | 4.8 | |
| Length [mm]: | 51.0 | |
| Standardlänge [mm]: | 51.0 | |
| Min. thermal resistance [K/W]: | 8.0 |
- Extruded heatsinks especially for IC’s in DUAL IN LINE case. - Mounting by single component thermal conductive adhesive - Standard length: - 6,3 mm for 14/16 pins - 33 mm for 24 pins - 37 mm for 28 pins - 47 mm for 35 pins - 51 mm for 40 pins - Other lengths and machining on request.
