PR 33/25,4/MC
Product features
| Semiconductor casing: | TO-220 ; TO-218 ; TOP-3 | |
| Semiconductor mounted by: | Clip Mounting | |
| Heat sink mounted by: | Solder | |
| Finish | Black Anodised | |
| Material | AlMgSi0,5 | |
| Width [mm]: | 42.0 | |
| Height [mm]: | 25.0 | |
| Length [mm]: | 25.4 | |
| Min. thermal resistance [K/W]: | 6.0 |
- Special extruded heatsink for semiconductor case TO220, TO218(TOP3) - Aluminium, anodised black, solderable - Standard heights: 25.4, 38.1, 50.8 and 63.5 mm - Version MC (Mounting clip) for clip mounting of semiconductor. - Heatsink solderable by tin plated solder pins
